MT48LC64M4A2FG-75L View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT48LC64M4A2FG-75L' PDF : 86 Pages View PDF
256Mb: x4, x8, x16 SDRAM
Package Dimensions
Figure 8: 60-Ball FBGA "FB/BB" (8mm x 16mm) (x4, x8)
0.155 ±0.013
0.850 ±0.05
60X Ø 0.45
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
BALL
A8
2.40 ±0.05
CTR
8.00 ±0.10
5.60
0.80
TYP
8.00 ±0.05
16.00 ±0.10
5.60
0.10 A
SEATING PLANE
A
BALL #1 ID
BALL A1
0.80
TYP
CL
11.20
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
SUBSTRATE:
PLASTIC LAMINATE
ENCAPSULATION MATERIAL:
EPOXY NOVOLAC
BALL #1 ID
2.80
4.00 ±0.05
1.20 MAX
Notes:
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. S 12/12 EN
16
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
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