MT55L512L18PF-7.5IT View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT55L512L18PF-7.5IT' PDF : 30 Pages View PDF
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
165-PIN FBGA
0.85 ±0.075
0.12 C
SEATING PLANE
BALL A11
165X Ø 0.45
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
C
10.00
1.00
TYP
BALL A1
PIN A1 ID
1.20 MAX
7.50 ±0.05
PIN A1 ID
15.00 ±0.10
7.00 ±0.05
14.00
1.00
TYP
5.00 ±0.05
6.50 ±0.05
13.00 ±0.10
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
MIN
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
28
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
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