MT55L512L18PF-7.5IT View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT55L512L18PF-7.5IT' PDF : 30 Pages View PDF
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
119-PIN BGA
22.00 ±0.20
19.94 ±0.10
14.00 ±0.10
0.15
11.94 ±0.10
SEATING PLANE
Substrate material:
BT resin laminate
0.60 ±0.10
0.90 ±0.10
2.40 MAX
A1 CORNER
A1 CORNER
Ø 0.75 ±0.15 (dimension applies to a
noncollapsed solder ball)
1.27 (TYP)
7.62
20.32
1.27 (TYP)
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
MIN
2. Solder ball land pad is 0.6mm.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark of Micron Technology, Inc.
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc.,
and the architecture is supported by Micron Technology, Inc., and Motorola Inc.
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
29
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
Share Link: 
