NTLJS2103P View Datasheet(PDF) - ON Semiconductor
Part Name
Description
MFG CO.
'NTLJS2103P' PDF : 8 Pages View PDF
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN6 2x2
CASE 506AP−01
ISSUE B
DATE 26 APR 2006
SCALE 4:1
D
A
B
ÍÍÍ PIN ONE
REFERENCE
ÍÍÍÍÍÍ 2X
0.10 C
E
2X
0.10 C
0.10 C
A3
A
7X 0.08 C
6X L
D2
1
E2
A1
4X
e
L2
3
C
SEATING
PLANE
b1 6X
0.10 C A B
0.05 C
K
6
J
J1
NOTE 5
4
b 6X
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 2:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.20mm FROM
TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
1. CENTER TERMINAL LEAD IS OPTIONAL. TERMINAL
LEAD IS CONNECTED TO TERMINAL LEAD # 4.
2. PINS 1, 2, 5 AND 6 ARE TIED TO THE FLAG.
MILLIMETERS
DIM MIN MAX
A 0.70 0.80
A1 0.00 0.05
A3
0.20 REF
b 0.25 0.35
b1 0.51 0.61
D
2.00 BSC
D2 1.00 1.20
E
2.00 BSC
E2 1.10 1.30
e
0.65 BSC
K
0.15 REF
L 0.20 0.30
L2 0.20 0.30
J
0.27 REF
J1
0.65 REF
GENERIC
MARKING DIAGRAM*
1
6
2 XX M 5
3
4
XX = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
2.30
6X
0.43
1.10
6X
0.35
1
1.25
0.60
0.35
0.34
DOCUMENT NUMBER: 98AON20860D
DESCRIPTION: 6 PIN WDFN 2X2, 0.65P
0.65
PITCH
0.66
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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