PC8260 PowerQUICC II
Applicable Documents
Requirements
General
Terminal Connections
Absolute Maximum Ratings
Warning
1. MIL-STD-883: Test methods and procedures for electronics.
2. SQ32S0100.0: Quality levels for supplied components.
The microcircuits are in accordance with the applicable documents and as specified
herein.
The terminal connections are shown in Table 2 on page 8.
Table 5. Maximum Ratings
Symbol
Rating
Value
Unit
VDD
Core Supply Voltage
-0.3/2.75
V
VCCSYN
PLL Supply Voltage
-0.3/2.75
V
VDDH
I/O Supply Voltage
-0.3/3.6
V
VIN
Input Voltage
(GND-0.3)/3.6
V
TSTG
Storage Temperature Range
-65/+150
°C
Note:
Absolute maximum ratings are stress ratings only. Functional operation (see Table on
page 34) at the maximums is not guaranteed. Stress beyond those listed may affect
device reliability or cause permanent damage.
VIN must not exceed VDDH by more than 2.5V at any time, including during power-on
reset. VDDH must not exceed VDD/VCCSYN by more than 1.6V at any time, including during
power-on reset. VDD/VCCSYN must not exceed VDDH by more than 0.4V at any time,
including during power-on reset. It is recommended to use a bootstrap diode between
the power rails, as shown in Figure 3.
Figure 3. Bootstrap Diodes for Power-up Sequencing
I/O Power
Core/Pll
Power
3.3V (VDDH)
MUR420
MUR420
2.5V(VDD/VCCSYN)
Select the bootstrap diodes so that a nominal VDD/VCCSYN is sourced from the VDDH
power supply until the VDD/VCCSYN power supply becomes active. In Figure 3, two
MUR420 Schottky barrier diodes are connected in a series; each has a forward voltage
(VF) of 0.6V at high currents, and so provides a 1.2V drop, maintaining 2.1V on the 2.5V
power line. Once the core/PLL power supply stabilizes at 2.5V, the bootstrap diode(s)
will be reverse biased with negligible leakage current.
33
2131B–HIREL–02/03