PCA9519 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCA9519' PDF : 18 Pages View PDF
NXP Semiconductors
PCA9519
4-channel level translating I2C-bus/SMBus repeater
5.2 Pin description
Table 3.
Symbol
EN
GND
VCC(A)
A1
A2
A3
A4
A5
A6
A7
A8
VCC(B)
B8
B7
B6
B5
B4
B3
B2
B1
n.c.
Pin description
Pin
Description
TSSOP20 HVQFN24
1
11
enable input (active HIGH)
10
22[1]
ground (0 V)
11
23
port A power supply
19
24
A1 port (low voltage side)[2]
18
1
A2 port (low voltage side)[2]
17
2
A3 port (low voltage side)[2]
16
3
A4 port (low voltage side)[2]
15
4
A5 port (low voltage side)[2]
14
5
A6 port (low voltage side)[2]
13
6
A7 port (low voltage side)[2]
12
7
A8 port (low voltage side)[2]
20
10
port B power supply
9
12
B8 port (SMBus/I2C-bus side)[2]
8
13
B7 port (SMBus/I2C-bus side)[2]
7
14
B6 port (SMBus/I2C-bus side)[2]
6
15
B5 port (SMBus/I2C-bus side)[2]
5
16
B4 port (SMBus/I2C-bus side)[2]
4
17
B3 port (SMBus/I2C-bus side)[2]
3
18
B2 port (SMBus/I2C-bus side)[2]
2
19
B1 port (SMBus/I2C-bus side)[2]
-
8, 9, 20, 21
[1] HVQFN24 package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
[2] Port A and port B can be used for either SCL or SDA.
PCA9519
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
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