PCF2123U/5GA/1 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF2123U/5GA/1' PDF : 63 Pages View PDF
NXP Semiconductors
PCF2123
SPI Real time clock/calendar
16. Package outline
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.85 mm
SOT758-1
terminal 1
index area
D
BA
E
A
A1
c
detail X
e1
C
1/2 e
e
vM C AB
b
wM C
y1 C
y
5
8
L
4
9
e
Eh
e2
1/2 e
1
12
terminal 1
16
13
index area
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D(1) Dh E(1) Eh
e
e1 e2
L
v
w
y
y1
mm
1
0.05 0.30
0.00 0.18
0.2
3.1 1.75
2.9 1.45
3.1
2.9
1.75
1.45
0.5
1.5
1.5
0.5
0.3
0.1
0.05 0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT758-1
---
MO-220
---
ISSUE DATE
02-03-25
02-10-21
Fig 31. Package outline SOT758-1 (HVQFN16) of PCF2123BS/1
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
© NXP B.V. 2013. All rights reserved.
45 of 64
Share Link: 
