PCF2123U/5GA/1 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF2123U/5GA/1' PDF : 63 Pages View PDF
NXP Semiconductors
PCF2123
SPI Real time clock/calendar
Table 48. Dimensions of PCF2123U/12
Original dimensions are in mm.
Unit (mm) A[1] A1
PCF2123U/12AA
A2[1] D[2]
max
-
0.018 -
-
nom
0.22 0.015 0.2 1.492
min
-
0.012 -
-
PCF2123U/12HA
max
-
0.018 -
-
nom
0.17 0.015 0.15 1.492
min
-
0.012 -
-
E[2]
-
1.449
-
-
1.449
-
e
1.296
-
0.198
1.296
-
0.198
P1[3]
-
0.09
-
-
0.09
-
[1] Nominal die thickness. Compare with wafer thickness given in Table 51.
[2] Dimension includes saw lane.
[3] P1 and P3: pad size.
[4] P2 and P4: bump size.
P2[4] P3[3]
0.084 -
0.081 0.09
0.078 -
0.084 -
0.081 0.09
0.078 -
P4[4]
0.084
0.081
0.078
0.084
0.081
0.078
Table 49. Bump locations of all PCF2123U types
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip; see Figure 33 and Figure 34.
Symbol
Bump
Coordinates
x
y
SDO
1
648.0
575.0
SDI
2
648.0
377.0
SCL
3
648.0
179.0
CLKOE
4
648.0
171.2
CLKOUT
5
648.0
369.2
VDD
6
OSCI
7
648.0
648.0
625.7
639.0
OSCO
8
648.0
421.9
TEST
9
648.0
25.9
INT
10
648.0
223.9
CE
11
648.0
441.0
VSS
12
648.0
639.0
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
© NXP B.V. 2013. All rights reserved.
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