PCF2123U/5GA/1 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF2123U/5GA/1' PDF : 63 Pages View PDF
NXP Semiconductors
17. Bare die outline
Wire bond die; 12 bonding pads
PCF2123
SPI Real time clock/calendar
PCF2123U/10
D
7
8
x
9
0
10
0
11
y
12
eD
6
5
4
E
3
2
1
X
A
0
1 mm
scale
P4 P3
P2
P1
detail X
OUTLINE
VERSION
IEC
PCF2123U/10
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
08-07-24
11-04-06
Fig 33. Bare die outline PCF2123U/10 of PCF2123U/5GA/1 and PCF2123U/10AA/1 (for dimensions see Table 47)
Table 47. Dimensions of PCF2123U/10
Original dimensions are in mm.
Unit (mm) A[1]
D[2]
E[2]
PCF2123U/5GA/1
nom
0.20
1.492 1.449
PCF2123U/10AA/1
nom
0.20
1.492 1.449
eD
1.296
1.296
P1[3]
0.09
0.09
P2[4]
0.081
0.081
[1] Nominal die thickness. Compare with wafer thickness given in Table 51.
[2] Dimension includes saw lane.
[3] P1 and P3: pad size.
[4] P2 and P4: passivation opening.
P3[3]
0.09
0.09
P4[4]
0.081
0.081
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
© NXP B.V. 2013. All rights reserved.
47 of 64
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