NXP Semiconductors
PCF8562
Universal LCD driver for low multiplex rates
15. Package outline
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
D
y
Z
48
c
25
E
A
X
HE
vM A
pin 1 index
1
e
A2
A1
24
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT362-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 22. Package outline SOT362-1 (TSSOP48)
PCF8562
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 June 2011
© NXP B.V. 2011. All rights reserved.
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