PCF8566 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF8566' PDF : 48 Pages View PDF
NXP Semiconductors
15. Bare die outline
PCF8566
Universal LCD driver for low multiplex rates
Wire bond die; 40 bonding pads; 2.5 x 2.91 x 0.381 mm
PCF8566U
D
e
A
25 24 23 22 21
26
F
27
28
29
30
31
32
33
34
35
x
0
0
y
36 37 38 39 40
20 19 18 17 16
C1
15
14
13
12
11
10
9
8
C2
7
6
12345
e
E
X
P4 P3
P2
P1
detail X
0
0.5
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
D
max 0.406
mm nom 0.381 2.5
min 0.356
Notes
1. Pad size
2. Passivation opening
E
e P1(1) P2(2) P3(1) P4(2)
0.548
2.91 0.200 0.12 0.106 0.12 0.106
0.018
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
PCF8566U
1 mm
Fig 31. Bare die outline PCF8566U
PCF8566_7
Product data sheet
Rev. 07 — 25 February 2009
EUROPEAN
PROJECTION
ISSUE DATE
08-06-19
08-09-03
© NXP B.V. 2009. All rights reserved.
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