PDSP16488A/C0/AC View Datasheet(PDF) - Zarlink Semiconductor Inc
Part Name
Description
MFG CO.
'PDSP16488A/C0/AC' PDF : 33 Pages View PDF
PDSP16488A
ELECTRICAL CHARACTERISTICS
The Electrical Characteristics are guaranteed over the following range of operating conditions, unless otherwise stated:
VDD = 15V±10%, GND = 0V, TAMB (Commercial) = 0°C to170°C, TAMB (Industrial) = 240°C to 185°C,
TAMB (Military) = 255°C to 1125°C
Static Characteristics
Characteristic
Value
Symbol
Units
Min. Typ. Max.
Conditions
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input leakage current
Input capacitance
Output leakage current
Output short circuit current
Current at full speed
VOH
2·4
-
V IOH = 4mA
VOL
-
0·4
V IOL = 28mA
VIH
2·0
-
V
VIL
-
0·8
V
IIN
210
1 1 0 µA GND < VIN < VDD, no internal pullup
CIN
10
pF
IOZ
250
1 5 0 µA GND < VOUT < VDD, no internal pullup
IOS
10
300 mA VDD = 15·5V
ISP
Max. mA
NOTE: Signal pins PC0, X15, MASTER, SINGLE and OVR have pullup resistors in the range 15kΩ to 200kΩ. BYPASS, PROG and DS have no internal pullup
resistors. When the device is used in EPROM mode, external pullup resistors should be connected to the PROG and DS pins.
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
Supply voltage, VDD
20·5V to 17·0V
Input voltage, VIN
20·5V to VDD 10·5V
Output voltage, VOUT
20·5V to VDD 10·5V
Clamp diode current per pin, IK (see note 2)
18mA
Static discharge voltage (HBM)
500V
Storage temperature, TS
265°C to1150°C
Maximum junction temperature, TJMAX
Commercial grade
195°C
Industrial grade
1110°C
Military grade
1150°C
Package power dissipation
2000mW
Thermal resistance, junction-to-case, θJC
5°C/W
NOTES
1. Exceeding these ratings may cause permanent damage.
Functional operation under these conditions is not implied.
2. Maximum dissipation should not be exceeded for more
than1 second, only one output to be tested at any one time.
3. Exposure to absolute maximum ratings for extended
periods may affect device reliablity.
4. Current is defined as negative into the device.
PDSP16488A MA ACBR and PDSP16488A MA GCPR
(MIL-STD-883 CLASS B PARTS)
Polyimide is used as an inter-layer dielectric and as
glassification. Polymeric material is also used for die attach
which, according to the requirements in paragraph 1.2.1, pre-
cludes categorising these devices as fully compliant. In every
other respect, these devices are manufactured and screened in
full accordance with MIL-STD-883 (latest revision).
The PDSP16488A MA ACBR (PGA packge) is subject to the
constant acceleration test, Method 2001, Test Condition A (5kg).
Life test/burn-in connections are given in Tables 12 and 13 on
the following page.
Change Notification
The change notification requirements of MIL-PRF-38535
will be implemented on MIL-STD-883 grade devices. Known
customers will be notified of any changes since the last buy
when ordering further parts if significant changes have been
made.
Rev.
A
B
C
D
Date MAR 1993 JUL 1996 NOV 1997
16
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