SPC5607BECLLR View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'SPC5607BECLLR' PDF : 92 Pages View PDF
Electrical characteristics
Table 11. 208 MAPBGA thermal characteristics1
Symbol
C
Parameter Conditions
Value
Unit
RθJA
CC
—
Thermal
Single-layer
resistance, board—1s
junction-to-am
bient natural
Four-layer
convection2 board—2s2p
TBD
°C/W
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
2 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA
and RthJMA.
3.5.3 Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD x RθJA)
Eqn. 1
Where:
TA is the ambient temperature in °C.
RθJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD = PINT + PI/O).
PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.
PI/O represents the power dissipation on input and output pins; user determined.
Most of the time for the applications, PI/O < PINT and may be neglected. On the other hand, PI/O may be significant, if the device
is configured to continuously drive external modules and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273 °C)
Eqn. 2
Therefore, solving equations 1 and 2:
K = PD x (TA + 273 °C) + RθJA x PD2
Eqn. 3
Where:
K is a constant for the particular part, which may be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ may be obtained by solving equations 1 and 2
iteratively for any value of TA.
3.6 I/O pad electrical characteristics
3.6.1 I/O pad types
The device provides four main I/O pad types depending on the associated alternate functions:
• Slow pads - are the most common pads, providing a good compromise between transition time and low
electromagnetic emission.
• Medium pads - provide transition fast enough for the serial communication channels with controlled current to reduce
electromagnetic emission.
MPC5607B Microcontroller Data Sheet, Rev. 3
18
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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