SPC5607BECLLR View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'SPC5607BECLLR' PDF : 92 Pages View PDF
Electrical characteristics
3.8 Power management electrical characteristics
3.8.1 Voltage regulator electrical characteristics
The device implements an internal voltage regulator to generate the low voltage core supply VDD_LV from the high voltage
ballast supply VDD_BV. The regulator itself is supplied by the common I/O supply VDD. The following supplies are involved:
• HV: High voltage external power supply for voltage regulator module. This must be provided externally through VDD
power pin.
• BV: High voltage external power supply for internal ballast module. This must be provided externally through VDD_BV
power pin. Voltage values should be aligned with VDD.
• LV: Low voltage internal power supply for core, FMPLL and Flash digital logic. This is generated by the internal
voltage regulator but provided outside to connect stability capacitor. It is further split into four main domains to ensure
noise isolation between critical LV modules within the device:
— LV_COR: Low voltage supply for the core. It is also `used to provide supply for FMPLL through double bonding.
— LV_CFLA: Low voltage supply for code Flash module. It is supplied with dedicated ballast and shorted to
LV_COR through double bonding.
— LV_DFLA: Low voltage supply for data Flash module. It is supplied with dedicated ballast and shorted to
LV_COR through double bonding.
— LV_PLL: Low voltage supply for FMPLL. It is shorted to LV_COR through double bonding.
CREG2 (LV_COR/LV_CFLA)
VDD_BV
VDD
GND
VSS_LV
VDD_LV
VREF
VDD_BV
VDD_LVn
VSS_LVn
Voltage Regulator
I
GND
DEVICE
VDD_LV
DEVICE
VSS_LV
VSS_LV
VDD_LV
VSS
VDD
GND
GND
CREG3 (LV_COR/LV_PLL)
CDEC2 (supply/IO decoupling)
Figure 8. Voltage regulator capacitance connection
The internal voltage regulator requires external capacitance (CREGn) to be connected to the device in order to provide a stable
low voltage digital supply to the device. Capacitances should be placed on the board as near as possible to the associated pins.
Care should also be taken to limit the serial inductance of the board to less than 5 nH.
MPC5607B Microcontroller Data Sheet, Rev. 3
30
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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