ST72334J/N, ST72314J/N, ST72124J
PACKAGES (Cont’d)
9.1.2 User-supplied TQFP64 Adaptor / Socket
To solder the TQFP64 device directly on the appli-
cation board, or to solder a socket for connecting
the emulator probe, the application board should
provide the footprint described in Figure 71. This
footprint allows both configurations:
s Direct TQFP64 soldering
s YAMAICHI IC149-064-008-S5* socket
soldering to plug either the emulator probe or an
adaptor board with an TQFP64 clamshell
socket.
* Not compatible with TQFP64 package.
Figure 71. TQFP64 Device And Emulator Probe Compatible Footprint
SK
E
E1
E3
SOCKET
e
B
DETAIL
mm
inch es
Dim
Min Typ Max Min Typ Max
B 0.35 0.45 0.50 0.014 0.018 0.020
E 20.80
0.819
E1
14.00
0.551
E3 11.90 12.00 12.10 0.468 0.472 0.476
e 0.75 0.80 0.85 0.029 0.031 0.033
SK*
26
1.023
Number of Pins
N
64 (4x16)
* SK: Plastic socket overall dimensions.
Table 22. Suggested List of TQFP64 Socket Types
Package / Probe
TQ FP64
EMU PROBE
ENPLAS
YAMAICHI
YAMAICHI
Adaptor / Socket Reference
OTQ-64-0.8-02
IC51-0644-1240.KS-14584
IC149-064-008-S5
Socket type
Open Top
Clamshell
SMC
119/125