ST7LITE2
PACKAGE CHARACTERISTICS (Cont’d)
Table 21. THERMAL CHARACTERISTICS
Symbol
RthJA
TJmax
PDmax
Ratings
Package thermal resistance
(junction to ambient)
Maximum junction temperature 1)
Power dissipation 2)
SO20
DIP20
Value
125
63
150
500
Unit
°C/W
°C
mW
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the
chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application.
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