STI5512 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STI5512' PDF : 23 Pages View PDF
CONFIDENTIAL STi5512
5 STi5512 Package specifications
5.1 Package diagram
The STi5512 is packaged in a 256-pin ball grid array (BGA) with 16 additional central ground balls.
Figure 5 256-pin BGA package
5.2 Package pinout
The following pages give the allocation of pins to the package, shown from the top looking down. The uses of the pins
are given in Chapter 4.
NC indicates that the pin is reserved; do not connect these pins.
5.3 Package dimensions
Table 16 gives the values of the dimensions marked in Figure 6 .
7110123 B
19//23
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