STV0056AF View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STV0056AF' PDF : 27 Pages View PDF
STV0056AF
PIN INTERNAL CIRCUITRY (continued)
VREF
The 400µA source is off during stand-by mode.
Figure 24
Vbg 1.2V
4
10kΩ
43 VREF (2.4V)
10kΩ
400µA
LEVEL L, LEVEL R
Figure 25
VREF 2.4V
Audio
SW
49kΩ
49kΩ
GND 0V
50kΩ
1
100µA
Pins 59 - 53
LEVEL R
LEVEL L
PK IN L, PK IN R
Figure 26
VREF 2.4V
Pins 58 - 54
PK IN R
PK IN L
67kΩ
1
To Peak Det
100µA
V 12V
Doubled bonded (two bond wires and two pads for
one package pin) :
- One pad is connected to all of the 12V ESD and
video guard rings.
- The second pad is connected to power up the
video block.
V GND
Doubled bonded :
- One pad is connectedto power-up all of the video
mux and I/O.
- The second pad is only as a low noise GND for
the video input.
VDD 5V, GND 5V
Connected to XTL oscillator and the bulk of the
CMOS logic and 5V ESD.
A GND
Doubled bonded :
- One pad connected to the left VCO, dividers,
mixers and guard ring. the guard connection is
star connected directly to the pad.
- The second pad is connected to both AGC amps
and the deemphasis amplifiers, frequency syn-
thesis and FM deviation selection circuit for both
channels.
A 12V
Doubled bonded :
- One pad connected to the ESD and guard ring.
- The second pad is connected to the main power
for all of the audio parts.
A GND R
Boubled bonded :
- One pad connected to the right VCO, dividers,
mixers and guard ring. The guard connection is
star connected directly to the pad.
- The second pad is connected to the bias block,
audio noise reduction, volume, mux and ESD.
A third bond wire on this pin is connected directly
to the die pad (substrate).
Figure 27
Pins 10 - 11
V 12V
Video Pads
Pins 13 - 14
V GND
VDD 5V 32
Vpp
BIP 10vpl
Vmm
Digital Pads
GND 5V 33
Pins 41 - 42
A GND L
A 12V
Audio Pads
Substrate
A GND R 56
205Ω
+
BIP
12V
-
DZPN1
DZPN1
DZPN1
17/27
Share Link: 
