TDA75612LV View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
TDA75612LV
STMicroelectronics
'TDA75612LV' PDF : 35 Pages View PDF
Thermal protection
7
Thermal protection
TDA75612LV
Thermal protection is implemented through thermal foldback (Figure 17).
Thermal foldback begins limiting the audio input to the amplifier stage as the junction
temperatures rise above the normal operating range. This effectively limits the output power
capability of the device thus reducing the temperature to acceptable levels without totally
interrupting the operation of the device.
The output power will decrease to the point at which thermal equilibrium is reached.
Thermal equilibrium will be reached when the reduction in output power reduces the
dissipated power such that the die temperature falls below the thermal foldback threshold.
Should the device cool, the audio level will increase until a new thermal equilibrium is
reached or the amplifier reaches full power. Thermal foldback will reduce the audio output
level in a linear manner.
Three thermal warning are available through the I2C bus data. After thermal shut down
threshold is reached, the CD could toggle (as shown in Figure 17) or stay low, depending on
signal level.
Figure 17. Thermal foldback diagram
6OUT
4( 7! 2. 4 ( 7 ! 2 . 4 ( 7 ! 2 .
/.
/.
/.
6OUT
4( 3(
34!24
4( 3( 4J #
%.$
#$ OUT
43$
3$ WITH SAME INPUT
SIGNAL
4J #
4J #
*$3*36
7.1
Fast muting
The muting time can be shortened to less than 1.5 ms by setting (IB2) D5 = 1. This option
can be useful in transient battery situations (i.e. during car engine cranking) to quickly
turnoff the amplifier for avoiding any audible effects caused by noise/transients being
injected by preamp stages. The bit must be set back to “0” shortly after the mute transition.
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DocID025639 Rev 4
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