TGA4953-SL View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA4953-SL' PDF : 19 Pages View PDF
Product Datasheet
Jan 4, 2012
Assembly Notes
• Proper ESD precautions must be followed while handling parts.
• Parts must be in dry condition prior to soldering. See shipping label instructions.
• TGA4953-SL may be processed using conventional SMT processes.
• Both, lead-free and leaded solders may be used while maintaining following limits:
• Maximum temperature ........ 260°C
• Total time above 220°C ...... 60 seconds
• Maximum ramp rate ............ 3°C/second
• Time within 5 °C of Peak Temperature ............10 – 20 sec max
• Typical solder reflow profiles are shown in figures below.
• Hand soldering is not recommended. Solder paste may be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to ensure
consistent mechanical and electrical performance.
• TGA4953-SL may be removed from circuit board and re-soldered once. After removal, solder pads must
leveled and cleaned. Prior to re-soldering, the part must be dried in accordance with shipping label
instructionsS. older reflow profiles for lead-free solders
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 info-networks@tqs.com 18
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