TGS2351 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGS2351' PDF : 11 Pages View PDF
TGS2351
DC – 6 GHz High Power SPDT Switch
Product Compliance Information
ESD Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ECCN
US Department of Commerce EAR99
Solderability
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Assembly Notes
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Organic attachment (i.e. epoxy) can be used in low-power applications.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
• Use AuSn (80/20) solder and limit exposure to temperatures above 300C to 3-4 minutes, maximum.
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• Do not use any kind of flux.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Devices with small pad sizes should be bonded with 0.0007-inch wire.
Data Sheet: Rev B 06/20/12
© 2012 TriQuint Semiconductor, Inc.
- 10 of 11 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Share Link: 
