TGS2351 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGS2351' PDF : 11 Pages View PDF
TGS2351
DC – 6 GHz High Power SPDT Switch
Mechanical Information
0.175 0.300
0.919 0.984
1.652
1.477
23
4
1.476
1.276
1.031
0.826
1
0.621
0.176
76
0.0
0.377
5
0.176
0.0 0.175 0.300
0.919 1.150
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
2, 7
3, 6
4
5
Symbol
RF In
Vc2
Vc1
RF Out1
RF Out2
Pad Size
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
0.200 x 0.100
0.200 x 0.100
Data Sheet: Rev B 06/20/12
© 2012 TriQuint Semiconductor, Inc.
- 9 of 11 -
Disclaimer: Subject to change without notice
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