TS4972 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS4972' PDF : 30 Pages View PDF
Package Mechanical Data
5 Package Mechanical Data
5.1 Flip-Chip - 8 BUMPS
0.5
0.5
1.6
TS4972
■ Die size : (2.26mm ±10%) x (1.6mm ±10%)
■ Die height (including bumps) : 650µm ± 50
■ Bumps diameter : 315µm ±15µm
■ Silicon thickness : 400µm ±25µm
■ Pitch: 500µm ±10µm
2.26
Figure 90: Pin Out (top view)
■ Balls are underneath
400µm
250µm
650µm
Figure 91: Marking (top view)
E
A72
YWW
29/30
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