WM8960 View Datasheet(PDF) - Cirrus Logic
Part Name
Description
MFG CO.
'WM8960' PDF : 91 Pages View PDF
WM8960
REGISTER
ADDRESS
R27 (1Bh)
Additional
Control (3)
BIT
LABEL
3
OUT3CAP
R48 (30h)
Additional
Control (4)
3:2 HPSEL[1:0]
R23 (17h)
0
TOEN
Additional
Control (1)
1
TOCLKSEL
Table 30 Headphone Jack Detect
DEFAULT
Production Data
DESCRIPTION
0
Capless Mode Headphone Switch
Enable
0 = OUT3 unaffected by jack detect
events
1 = OUT3 enabled and disabled together
with HP_L and HP_R in response to jack
detect events
00
Headphone Switch Input Select
0X = GPIO1 used for jack detect input
(Requires ADCLRC pin to be configured
as a GPIO)
10 = JD2 used for jack detect input
11 = JD3 used for jack detect input
0
Slow Clock Enable (Must be enabled for
jack detect de-bounce)
0 = Slow Clock Disabled
1 = Slow Clock Enabled
0
Slow Clock Selection (Used for volume
update timeouts and for jack detect
debounce)
0 = SYSCLK / 221 (Slower Response)
1 = SYSCLK / 219 (Faster Response)
Figure 20 Example Headset Detection Circuit Using Normally-Open Switch
Figure 21 Example Headset Detection Circuit Using Normally-Closed Switch
THERMAL SHUTDOWN
The speaker and headphone outputs can drive very large currents. To protect the WM8960 from
overheating a thermal shutdown circuit is included and is enabled by default. If the device
temperature reaches approximately 1500C and the thermal shutdown circuit is enabled (TSDEN = 1;
TSENSEN = 1) the speaker and headphone amplifiers (HP_L, HP_R, SPK_LP, SPK_LN, SPK_RP,
SPK_RN and OUT3) will be disabled. This feature can be disabled to save power when the device is
in standby mode.
TSENSEN must be set to 1 to enable the temperature sensor when using the TSDEN thermal
shutdown function. The output of the temperature sensor can also be output to the GPIO1 pin.
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PD, August 2013, Rev 4.2
46
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