ADJD-S312-CR999 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'ADJD-S312-CR999' PDF : 18 Pages View PDF
Recommended Underfill Type and Characteristic
• Low moisture absorption type
• Total height of underfill from PCB plane to cover up 70 – 85 %
• Underfill to cover all 4 side of the package
Height
70 ~ 85%
Underfill PCB
Recommended Reflow Profile
It is recommended that Henkel Pb-free solder paste LF310 be used for soldering ADJD-S312-CR999. Below is the
recommended reflow profile.
T-peak 240 ± 5°C
T-reflow 217~220 °C
T-max. 180°C
T-min. 160°C
Delta-Ramp
max. 1 °C/sec.
Delta-Flux
max. 2 °C/sec.
Delta-Cooling
max. 2 °C/sec.
t-comp
100 ~ 140 sec.
t-pre
TIME
90 ~ 120 sec.
t-reflow
14
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