ADJD-S312-CR999 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'ADJD-S312-CR999' PDF : 18 Pages View PDF
Recommended PCB land pad design
• NiAu flash over copper pad
• Pad Diameter (C)= 0.20 mm
• NSMD Diameter (D)= 0.25 ~ 0.30 mm
NSMD
After soldering or mounting precaution
Please ensure that all soldered or reflowed CSP package
that is mounted on the PCB is not exposed to compres-
sion or loading force directly perpendicular to the flat
top surface.
Precaution:
Excessive loading force directly perpendicular to the flat
top surface may cause pre-mature failure.
Loading Force
PCB
Recommended Stencil Design
• Stencil thickness
5 mils
• Stencil type
Ni Electroforming
• Stencil Aperture Type Square
• Stencil Aperture
310 um
• Additional Feature
Rounded square edge
310 um
560 um
15
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