Recommendations for Handling and Storage of ADJD-S312
This product is qualified as Moisture Sensitive Level 3 per Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305
Handling Of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
• Unopened moisture barrier bag (MBB) can be stored at 30°C and 90%RH or less for maximum 1 year
• It is not recommended to open the MBB prior to assembly (e.g. for IQC)
• It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride) to
indicate the moisture within the bag
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read immediately upon opening of MBB
• The components must be kept at <30°C/60%RH at all time and all high temperature related process including
soldering, curing or rework need to be completed within 168hrs
C. Control for unfinished reel
• For any unused components, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH
D. Control of assembled boards
• If the PCB soldered with the components is to be subjected to other high temperature processes, the PCB need
to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no components have exceeded their
floor life of 168hrs
E. Baking is required if:
• “10%” or “15%” HIC indicator turns pink
• The components are exposed to condition of >30°C/60%RH at any time.
• The components floor life exceeded 168hrs
• Recommended baking condition (in component form): 125°C for 24hrs
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