ADSP-21371KSWZ-2A2 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21371KSWZ-2A2' PDF : 52 Pages View PDF
ADSP-21371/ADSP-21375
10
8
6
Y = 0.0488X - 1.5923
4
2
0
-2
-4
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 40. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
THERMAL CHARACTERISTICS
The processor is rated for performance over the temperature
range specified in Operating Conditions on Page 16.
Table 42 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standard JESD51-7 (LQFP_EP). The junction-to-case
measurement complies with MIL- STD-883. All measurements
use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
TJ = TCASE + (ΨJT × PD)
where:
TJ = junction temperature °C
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the Typical value from Table 42.
PD = power dissipation
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approxi-
mation of TJ by the equation
TJ = TA + (θJA × PD)
where:
TA = ambient temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val-
ues provided in Table 42 are modeled values.
Table 42. Thermal Characteristics for 208-Lead LQFP
E_PAD (With Exposed Pad Soldered to PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
ΨJB
ΨJMB
ΨJMB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
17.1
14.7
14.0
9.6
0.23
0.39
0.45
11.5
11.2
11.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. C | Page 46 of 52 | September 2009
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