NXP Semiconductors
9. Package outline
Flanged LDMOST ceramic package; 2 mounting holes; 4 leads
BLF369
Multi-use VHF power LDMOS transistor
SOT800-2
D
A
F
y
D1
U1
q
1
2
B
C
c
w1 M A M B M
H U2
L
A
3
4
b
e
P
5
w2 M C M
E
E1
Q
0
5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
c
D
D1
E
E1
e
F
H
L
p
Q
q
U1 U2 w1 w2
y
mm 6.3 10.55 0.15 30.5 31.1 14.6 15.3 12.7 2.26 22.8 3.7 3.56 3.1 38.5 44.5 15.4 0.25
5.9 10.45 0.10 29.9 30.9 14.4 15.1
2.00 21.8 3.3 3.49 2.8
44.2 15.0
inches
0.248
0.232
0.415
0.411
0.006
0.004
1.201
1.177
1.224
1.216
0.575
0.567
0.602
0.594
0.5
0.089
0.079
0.898
0.858
0.146
0.130
0.140
0.137
0.122
0.110
1.516
1.752
1.740
0.606
0.591
0.01
0.25 0.05
0.01 0.002
OUTLINE
VERSION
IEC
SOT800-2
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-06-02
05-06-07
Fig 17. Package outline SOT800-2
BLF369_3
Preliminary data sheet
Rev. 03 — 29 January 2008
© NXP B.V. 2008. All rights reserved.
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