CY8C20110 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
MFG CO.
'CY8C20110' PDF : 46 Pages View PDF
CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
Document History Page
Document Title: CY8C20110/CY8C20180/CY8C20160/CY8C20140/CY8C20142, CapSense® Express™ Button Capacitive
Controllers
Document Number: 001-54606
Rev.
ECN
Orig. of Submission
Change
Date
Description of Change
**
2741726 SLAN / 07/21/2009 New data sheet.
FSU
*A
2821828 SSHH / 12/4/2009 Added Contents.
FSU
Updated Absolute Maximum Ratings (Added F32k u, tPOWERUP parameters
and their details).
Updated Electrical Specifications (Updated DC Electrical Specifications
(Updated DC Flash Write Specifications (Updated Note 29))).
*B
2892629
NJF
03/15/2010 Updated Pin Definitions (Added a Note “For information on the preferred
dimensions for mounting QFN packages, see the "Application Notes for
Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages"
available at http://www.amkor.com.” below the column).
Updated Absolute Maximum Ratings (Added TBAKETEMP and TBAKETIME
parameters and their details).
Updated Package Diagrams (Updated Figure 1 (Changed 16-pin COL to
16-pin QFN).
*C
3002214 SLAN 07/29/2010 Updated Features (Changed the part number from CY8C21110 to
CY8C20110).
Added Acronyms and Units of Measure.
Minor edits across the document.
*D
3042142 ARVM
09/30/10 Updated Pin Definitions (Added Note 3 and referred the same Note in all
GP1[1] and GP1[2] pins).
Updated Pin Definitions (Added Note 6 and referred the same Note in all
GP1[1] and GP1[2] pins).
Updated Pin Definitions (Added Note 7 and referred the same Note in all
GP1[1] and GP1[2] pins).
Updated Absolute Maximum Ratings (Removed F32k u, tPOWERUP parameters
and their details).
Updated Electrical Specifications (Updated AC Electrical Specifications
(Added AC Chip-Level Specifications section)).
Updated Typical Circuits (Updated Figure 4 (Replaced with updated one)).
Updated in new template.
*E
3085081
NJF
11/12/10
Updated Electrical Specifications (Updated DC Electrical Specifications
(Updated DC GPIO Specifications (Removed sub-section “2.7-V DC Spec for
I2C Line with 1.8 V External Pull-up”), added DC I2C Specifications)), updated
AC Electrical Specifications (Updated AC I2C Specifications (Updated
Figure 12 (No specific changed were made to I2C Timing Diagram. Updated
for clearer understanding.)))).
Updated Solder Reflow Specifications (Updated Table 16).
Added Reference Documents and Glossary.
Updated in new template.
*F
3276234 ARVM
06/07/11 Updated Layout Guidelines and Best Practices (Updated Table 2 (Removed
“Overlay thickness-buttons” category),
added the following statement after Table 2 –
“The Recommended maximum overlay thickness is 5 mm (with external CSInt)/
2 mm (without external CSInt). For more details refer to the section “The
Integrating Capacitor (Cint)” in AN53490.
Note Some device packages does not have CSInt pin and external capacitor
cannot be connected.”).
Updated CapSense Constraints (Removed the parameter “Overlay
thickness”).
Updated Solder Reflow Specifications (Updated Table 16).
Document Number: 001-54606 Rev. *J
Page 44 of 46
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