PACKAGE DESCRIPTION: 153 LEAD BGA (17 X 9 BALL ARRAY)
JEDEC MO-163
EDI9LC644V
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note:
Ball attach pad for above BGA is 480 microns, in diameter. Pad is solder mask defined.
ORDERING INFORMATION
Part Number
EDI9LC644V2012BC
EDI9LC644V2010BC
EDI9LC644V1612BC
EDI9LC644V1610BC
EDI9LC644V1512BC
EDI9LC644V1510BC
EDI9LC644V1312BC
EDI9LC644V1310BC
SSRAM Access SDRAM Access
200MHz
125MHz
200MHz
100MHz
166MHz
125MHz
166MHz
100MHz
150MHz
125MHz
150MHz
100MHz
133MHz
125MHz
133MHz
100MHz
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
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