AD5382
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted1.
Table 7.
Parameter
AVDD to AGND
DVDD to DGND
Digital Inputs to DGND
SDA/SCL to DGND
Digital Outputs to DGND
REFIN/REFOUT to AGND
AGND to DGND
VOUTx to AGND
Analog Inputs to AGND
MON_IN Inputs to AGND
MON_OUT to AGND
Operating Temperature Range
Commercial (B Version)
Storage Temperature Range
Junction Temperature (TJ max)
100-lead LQFP Package
θJA Thermal Impedance
Reflow Soldering
Peak Temperature
ESD
HBM
FICDM
Rating
–0.3 V to +7 V
–0.3 V to +7 V
–0.3 V to DVDD + 0.3 V
–0.3 V to + 7 V
–0.3 V to DVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
–0.3 V to +0.3 V
–0.3 V to AVDD+ 0.3 V
–0.3 V to AVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
–40°C to +85°C
–65°C to +150°C
150°C
44°C/W
230°C
6.5 kV
2 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 14 of 40