EVAL-ADV7619EB1Z View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-ADV7619EB1Z' PDF : 24 Pages View PDF
ADV7619
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
DVDD to GND
PVDD to GND
DVDDIO to GND
CVDD to GND
TVDD to GND
Digital Inputs to GND
5 V Tolerant Digital Inputs
to GND1
Digital Outputs to GND
XTALP, XTALN
SCL, SDA Data Pins to
DVDDIO
Maximum Junction
Temperature (TJ MAX)
Storage Temperature Range
Infrared Reflow Soldering
(20 sec)
Rating
2.2 V
2.2 V
4.0 V
2.2 V
4.0 V
GND − 0.3 V to DVDDIO + 0.3 V
5.3 V
GND − 0.3 V to DVDDIO + 0.3 V
−0.3 V to PVDD + 0.3 V
DVDDIO − 0.3 V to DVDDIO + 3.6 V
125°C
−60°C to +150°C
260°
1 The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,
DDCA_SDA, DDCB_SCL, and DDCB_SDA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7619, the
user is advised to turn off the unused sections of the part.
Due to PCB metal variation and, therefore, variation in PCB
heat conductivity, the value of θJA may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this solution eliminates the variance associated with
the θJA value.
The maximum junction temperature (TJ MAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured package surface temperature
and applies only when no heat sink is used on the device under
test (DUT):
TJ = TS + (ΨJT × WTOTAL)
where:
TS is the package surface temperature (°C).
ΨJT = 0.22°C/W for the 128-lead TQFP_EP.
WTOTAL = ((PVDD × IPVDD) + (0.2 × TVDD × ITVDD) +
(CVDD × ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO))
where 0.2 is 20% of the TVDD power that is dissipated on the
part itself.
ESD CAUTION
Rev. B | Page 8 of 24
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