L/31ROPT1C View Datasheet(PDF) - Para Light Electronics
Part Name
Description
MFG CO.
'L/31ROPT1C' PDF : 12 Pages View PDF
ySOLDERING
3.0mm PHOTOTRANSISTOR
L-31ROPT1C
REV:A / 3
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
DIP
SOLDERING
Bath temperature: 260℃
Immersion time: with 5 sec, 1 time
base of the package
y Using soldering flux,” RESIN FLUX”
is recommended.
yAttached data of temperatuare cure
for your reference
y During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING Temperature at tip of iron: 260℃ or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
Ｌｅａｄ ｗｒｉｅｓ
Ｐａｎｅｌ
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Ｌｅａｄ ｗｒｉｅｓ
Ｌｅａｖｅ ａ ｓｌｉｇｈｔ
ｃｌｅａｒａｎｃｅ
(Fig.2)
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3
seconds.
DRAWING NO. : DS-21-02-0002
DATE : 2006-04-03
Page : 6
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