L/31ROPT1C View Datasheet(PDF) - Para Light Electronics
Part Name
Description
MFG CO.
'L/31ROPT1C' PDF : 12 Pages View PDF
3.0mm PHOTOTRANSISTOR
L-31ROPT1C
REV:A / 3
yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
Ｆｉｇ．７
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
DRAWING NO. : DS-21-02-0002
DATE : 2006-04-03
Page :9
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