sharp
LHF32KZ5
44
Sym.
VCC=5V±0.5V, 5V±0.25V, TA=0°C to +70°C
Versions
VCC=5V±0.25V(5)
Parameter
Notes Min.
Max.
VCC=5V±0.5V(6)
Min.
Max.
Unit
tAVAV
tPHWL
Write Cycle Time
RP# High Recovery to WE# Going
Low
70
2
1
80
ns
1
µs
tELWL BE# Setup to WE# Going Low
10
10
ns
tWLWH WE# Pulse Width
40
40
ns
tSHWH WP# VIH Setup to WE# Going High
2
100
100
ns
tVPWH VPP Setup to WE# Going High
2
100
100
ns
tAVWH Address Setup to WE# Going High
3
40
40
ns
tDVWH Data Setup to WE# Going High
3
40
40
ns
tWHDX Data Hold from WE# High
5
5
ns
tWHAX Address Hold from WE# High
5
5
ns
tWHEH BE# Hold from WE# High
10
10
ns
tWHWL WE# Pulse Width High
30
30
ns
tWHRL WE# High to STS Going Low
90
90
ns
tWHGL Write Recovery before Read
0
0
ns
tQVVL VPP Hold from Valid SRD, STS High Z 2,4
0
0
ns
tQVSL WP# VIH Hold from Valid SRD, STS
High Z
2,4
0
0
ns
NOTES:
1. Read timing characteristics during block erase, bank erase, (multi) wrod/byte write and block lock-bit
configuration operations are the same as during read-only operations. Refer to AC Characteristics for read-only
operations.
2. Sampled, not 100% tested.
3. Refer to Table 4 for valid AIN and DIN for block erase, bank erase, (multi) word/byte write or block lock-bit
configuration.
4. VPP should be held at VPPH1/2/3 until determination of block erase, bank erase, (multi) word/byte write or block
lock-bit configuration success (SR.1/3/4/5=0).
5. See Transient Input/Output Reference Waveform and Transient Equivalent Testing Load Circuit (High Seed
Configuration) for testing characteristics.
6. See Transient Input/Output Reference Waveform and Transient Equivalent Testing Load Circuit (Standard
Configuration) for testing characteristics.