NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
TFBGA180: thin fine-pitch ball grid array package; 180 balls
D
ball A1
index area
BA
A2
E
A
A1
detail X
SOT570-3
e1
e
1/2 e b
∅v M C A B
∅w M C
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ball A1
index area
1 3 5 7 9 11 13
2 4 6 8 10 12 14
e
e2
1/2 e
y1 C
C
y
X
0
DIMENSIONS (mm are the original dimensions)
5
scale
10 mm
UNIT
A
A1 A2
b
D
E
e
e1 e2
v
w
y
y1
max 1.20 0.40 0.80 0.50 12.1 12.1
mm nom 1.06 0.35 0.71 0.45 12.0 12.0 0.8 10.4 10.4 0.15 0.05 0.12 0.1
min 0.95 0.30 0.65 0.40 11.9 11.9
OUTLINE
VERSION
IEC
SOT570-3
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
Fig 43. TFBGA180 package
ISSUE DATE
08-07-09
10-04-15
LPC178X_7X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.5 — 26 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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