NXP Semiconductors
16. Soldering
Footprint information for reflow soldering of LQFP208 package
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
SOT459-1
Hx
Gx
P2
P1
(0.125)
Hy Gy
By Ay
C
solder land
occupied area
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
DIMENSIONS in mm
P1
P2
Ax
Ay
Bx
By
C
D1 D2 Gx Gy Hx Hy
0.500 0.560 31.300 31.300 28.300 28.300 1.500 0.280 0.400 28.500 28.500 31.550 31.550
sot459-1_fr
Fig 45. Reflow soldering of the LQFP208 package
LPC178X_7X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.5 — 26 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
114 of 126