M25P16-VMN3TP View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'M25P16-VMN3TP' PDF : 62 Pages View PDF
Micron M25P16 Serial Flash Embedded Memory
Package Information
Figure 35: UFDFPN8 (MLP8) 4mm x 3mm
4.00 ±0.10
A
B
Datum A
0.80 ±0.10
1
2
3
4
8 x (0.60 ±0.05)
0.20 DIA TYP
2X
0.10 C
2X
0.10 C
1
2
Top View
// 0.10 C 0.55+-00..0150
0.05 C
Seating Plane
0.127 MIN/ 0.02+-00..0023
0.15 MAX
Side View
3.00 ±0.10
C
0.20 ±0.10
Datum B
See detail A
(See note 1)
8 x (0.30 ±0.05)
8
7
6
5
0.80 TYP
0.10 M C A B
0.05 M C
Bottom View
Datum A or B
0.60 ±0.05
0.80 TYP
Terminal Tip
0.40 TYP
Even Terminal/Side
Detail A
Notes:
1. The dimension 0.30 ±0.05 applies to the metallic terminal and is measured between
0.15mm and 0.30mm from terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimensions should not be measured in that radius area.
2. Maximum package warping is 0.05mm; maximum allowable burrs is 0.076mm in all di-
rections; bilateral coplanarity zone apples to the exposed heat sink slug as well as to the
terminals.
3. Drawing is not to scale.
PDF: 09005aef8456656c
m25p16.pdf - Rev. J 1/18 EN
56
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© 2011 Micron Technology, Inc. All rights reserved.
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