Micron M25P16 Serial Flash Embedded Memory
Device Ordering Information
Device Ordering Information
Standard Parts
Micron Serial NOR Flash devices are available in different configurations and densities.
Verify valid part numbers by using Micron's part catalog search at micron.com. To com-
pare features and specifications by device type, visit micron.com/products. Contact the
factory for devices not found.
For more information on how to identify products and top-side marking by the process
identification letter, refer to technical note TN-12-24, "Serial Flash Memory Device
Marking for the M25P, M25PE, M25PX, and N25Q Product Families."
Table 25: Part Number Example
Device
Type Density
M25P
16
Security
Features
–
Operating
Voltage
V
Part Number Category
Device Packing
Package Grade Option
MN
6
T
Plating
Technology Lithography
P
B
Automotive
Grade
A
Table 26: Part Number Information Scheme
Part Number
Category
Device type
Density
Security features
Operating voltage
Package
Device Grade
Packing Option
Plating technology
Lithography
Category Details
M25P = Serial Flash memory for code storage
16 = 16Mb (2 Meg x 8)
– = no extra security
S = CFD programmed with UID
V = VCC = 2.7V to 3.6V
MN = SO8N (150 mils width)
MW = SO8W (208 mils width)
MF = SO16W (300 mils width)
MP = VFDFPN8 6mm x 5mm (MLP8)
ME = VFDFPN8 8mm x 6mm (MLP8)
MC = UFDFPN8 4mm x 3mm (MLP8)
6 = Industrial temperature range: –40°C to 85°C. Device tested with standard test flow.
3 = Automotive temperature range: –40°C to 125°C. Device tested with high reliability
test flow.
– = Standard packing (tube for SO8N, SO8W, and SO16W packages; tray for MLP pack-
ages)
T = Tape and reel packing
P or G = RoHS compliant
B = 110nm technology, Fab 13 diffusion plant
Notes
1
2
3
4, 5
PDF: 09005aef8456656c
m25p16.pdf - Rev. J 1/18 EN
58
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