M34C02-LDW1G View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M34C02-LDW1G' PDF : 31 Pages View PDF
M34C02-W, M34C02-L, M34C02-R
8
Package mechanical
Package mechanical
Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm², Package Outline
D
e
b
L3
L1
E
E2
A
A1
L
D2
ddd
UFDFPN-01
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
Table 15. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm², Package Mechanical Data
Symbol
Typ.
millimeters
Min.
Max.
Typ.
inches
Min.
Max.
A
0.55
0.50
0.60
0.022
0.020
0.024
A1
0.00
0.05
0.000
0.002
b
0.25
0.20
0.30
0.010
0.008
0.012
D
2.00
0.079
D2
1.55
1.65
0.061
0.065
ddd
0.05
0.002
E
3.00
0.118
E2
0.15
0.25
0.006
0.010
e
0.50
–
–
0.020
–
–
L
0.45
0.40
0.50
0.018
0.016
0.020
L1
0.15
0.006
L3
0.30
0.012
N
8
8
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