M34C02-LDW1G View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M34C02-LDW1G' PDF : 31 Pages View PDF
Revision history
10 Revision history
M34C02-W, M34C02-L, M34C02-R
Table 18. Document revision history
Date
Revision
Description of Revision
Adjustments to the formatting. 0 to 70°C temperature range removed from
27-Dec-1999 2.0 DC and AC tables.
No change to description of device, or parameters
07-Dec-2000
2.1
New definition of lead soldering temperature absolute rating for certain
packages
13-Mar-2001 2.2 -R voltage range added
18-Jul-2002
2.3 TSSOP8 (3x3mm² body size) package (MSOP8) added
22-May-2002 2.4 VFDFPN8 package (MLP8) added
21-Jul-2003
3.0 Document reformatted. -F voltage range added.
17-Mar-2004
Table of Contents added. MLP package changed. Absolute Maximum
4.0
Ratings for VIO(min) and VCC(min) changed. Soldering temperature
information clarified for RoHS compliant devices. Device grade information
clarified
14-Apr-2004 5.0 Typos corrected in Ordering Information example
26-Aug-2004 6.0 Device Grade clarified. Product List summary table added
30-Nov-2004 7.0 SO8 package removed.
14-Oct-2005
M34C02-R operating frequency upgraded to 400 kHz. Modified
Section 1.1: Device Internal Reset, Figure 4: Maximum RP value versus
bus parasitic capacitance (C) for an I²C Bus, Table 10: Input Parameters,
8.0
ICC1 values in Table 11: DC Characteristics (M34C02-W), Table 13: DC
Characteristics (M34C02-R), Table 15: DC Characteristics (M34C02-W-F)
and moved M34C02-R to Table 14: AC Characteristics M34C02-W,
M34C02-L, M34C02-R). Added Figure 3: Chip Enable input connection.
Added EcoPack® and Ambient Operating Temperature information.
11-Apr-2006
BN and DS (PDIP and TSSOP8) packages removed..
M34C02-F part number removed.
Test Conditions modified for ICC1 and VOL in Table 11: DC Characteristics
9 (M34C02-W).
Device Internal Reset removed and replaced by Section 2.5: Supply
voltage (VCC).
Blank option removed below Plating Technology in Table 17.
30/31
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