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M95256-CS3G View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'M95256-CS3G' PDF : 48 Pages View PDF
M95256-DR, M95256, M95256-W, M95256-R
10 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers the M95256 in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 23. SO8N – 8 lead plastic small outline, 150 mils body width, package outline
h x 45˚
A2
b
e
A
ccc
D
8
E1 E
1
A1
c
0.25 mm
GAUGE PLANE
k
L
L1
SO-A
1. Drawing is not to scale.
Table 21.
Symbol
SO8N – 8 lead plastic small outline, 150 mils body width, package data
millimeters
inches(1)
Typ
Min
Max
Typ
Min
Max
A
1.75
0.0689
A1
0.1
0.25
0.0039
0.0098
A2
1.25
0.0492
b
0.28
0.48
0.011
0.0189
c
0.17
0.23
0.0067
0.0091
ccc
0.1
0.0039
D
4.9
4.8
5
0.1929
0.189
0.1969
E
6
5.8
6.2
0.2362
0.2283
0.2441
E1
3.9
3.8
4
0.1535
0.1496
0.1575
e
1.27
-
-
0.05
-
-
h
0.25
0.5
0.0098
0.0197
k
L
0.4
1.27
0.0157
0.05
L1
1.04
0.0409
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 12276 Rev 11
39/48
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