Ethernet: Three-Speed Ethernet, MII Management
Figure 16 shows the RBMII and RTBI AC timing and multiplexing diagrams.
GTX_CLK
(At Transmitter)
TXD[8:5][3:0]
TXD[7:4][3:0]
TXD[3:0]
TXD[8:5]
TXD[7:4]
tRGTH
tSKRGT
tRGT
TX_CTL
TX_CLK
(At PHY)
TXD[4] TXD[9]
TXEN TXERR
tSKRGT
RXD[8:5][3:0]
RXD[7:4][3:0]
RX_CTL
RX_CLK
(At PHY)
RXD[3:0]
RXD[8:5]
RXD[7:4]
RXD[4] RXD[9]
RXDV RXERR
tSKRGT
tSKRGT
Figure 16. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.3 Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to the MII management interface signals management
data input/output (MDIO) and management data clock (MDC). The electrical characteristics for GMII,
RGMII, TBI and RTBI are specified in Section 8.1, “Three-Speed Ethernet Controller
(TSEC)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics.”
8.3.1 MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 2.5 or 3.3 V. The DC electrical
characteristics for MDIO and MDC are provided in Table 32 and Table 33.
Table 32. MII Management DC Electrical Characteristics Powered at 2.5 V
Parameter
Supply voltage (2.5 V)
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Symbol
LVDD
VOH
VOL
VIH
VIL
Conditions
—
IOH = –1.0 mA
IOL = 1.0 mA
—
—
LVDD = Min
LVDD = Min
LVDD = Min
LVDD = Min
Min
2.37
2.00
GND – 0.3
1.7
–0.3
Max
2.63
LVDD + 0.3
0.40
—
0.70
Unit
V
V
V
V
V
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
31