QL6325-E-8PT280I View Datasheet(PDF) - QuickLogic Corporation
Part Name
Description
MFG CO.
'QL6325-E-8PT280I' PDF : 56 Pages View PDF
QL6325E Eclipse-E Data Sheet Rev. F
Package Thermal Characteristics
Thermal Resistance Equations:
θJC = (TJ - TC)/P
θJA = (TJ - TA)/P
PMAX = (TJMAX - TAMAX)/ θJA
Parameter Description:
θJC: Junction-to-case thermal resistance
θJA: Junction-to-ambient thermal resistance
TJ: Junction temperature
TA: Ambient temperature
P: Power dissipated by the device while operating
PMAX: The maximum power dissipation for the device
TJMAX: Maximum junction temperature
TAMAX: Maximum ambient temperature
NOTE: Maximum junction temperature (TJMAX) is 150º C. To calculate the maximum power dissipation
for a device package look up θJA from Table 23, pick an appropriate TAMAX and use:
PMAX = (150º C - TAMAX)/ θJA
Device
QL6325E
Table 23: Package Thermal Characteristics
Package Description
Package Code Package Type Pin Count
PS
PBGA
484
PT
LFBGA
280
PQ
PQFP
208
0 LFM
26.6
34
32
θJA (º C/W)
200 LFM
24.1
13.6
28
400 LFM
21.8
29.9
26.5
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www.quicklogic.com
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