RC28F320J3F75 View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
RC28F320J3F75
Micron Technology
'RC28F320J3F75' PDF : 66 Pages View PDF
Numonyx® Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC)
3.0
Package Information
3.1
56-Lead TSOP Package for 32-, 64-, 128-Mbit
Figure 3: 56-Lead TSOP Package Mechanical
Z
See Notes 1 and 3
See Note 2
A2
Pin 1
e
E
See Detail B
D1
D
See Detail A
Y
A1
Seating
Plane
A
Detail A
C
Detail B
0
b
L
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Table 1: 56-Lead TSOP Dimension Table
Parameter
Package Height
Standoff
Package Body Thickness
Lead Width1
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
Terminal Dimension
Lead Tip Length
Symbol
A
A1
A2
b
c
D1
E
e
D
L
Millimeters
Min
—
0.050
0.965
0.170
0.100
18.200
13.800
—
19.800
0.500
Nom
—
—
0.995
0.220
0.150
18.400
14.000
0.500
20.00
0.600
Max
1.200
—
1.025
0.270
0.200
18.600
14.200
—
20.200
0.700
Min
—
0.002
0.038
0.0067
0.004
0.717
0.543
—
0.780
0.020
Inches
Nom
—
—
0.039
0.0087
0.006
0.724
0.551
0.0197
0.787
0.024
Max
0.047
—
0.040
0.0106
0.008
0.732
0.559
—
0.795
0.028
Jan 2011
208032-03
Datasheet
13
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