RC28F320J3F75 View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
RC28F320J3F75
Micron Technology
'RC28F320J3F75' PDF : 66 Pages View PDF
Numonyx® Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC)
Table 1: 56-Lead TSOP Dimension Table
Parameter
Symbol
Min
Millimeters
Nom
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
N
—
56
θ
0°
3°
Y
—
—
Z
0.150
0.250
1. For legacy lead width, 0.15mm (Typ), 0.10mm (Min), 0.20mm (Max).
Max
—
5°
0.100
0.350
Min
—
0°
—
0.006
Inches
Nom
56
3°
—
0.010
3.2
64-Ball Easy BGA Package for 32-, 64-, 128-Mbit
Max
—
5°
0.004
0.014
Figure 4: 64-Ball Easy BGA Mechanical Specifications
Ball A1
Corner
D
Ball A1
Corner
S1
12345678
A
B
C
D
E
F
G
H
87654321
A
B
C
D
E
E
F
G
H
S2
e
Top View - Plastic Backside
Complete Ink Mark Not Shown
A1
A2
b
Bottom View - Ball Side Up
A
Seating
Y
Plane
Table 2: Easy BGA Package Dimensions Table (Sheet 1 of 2)
Parameter
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Symbol
A
A1
A2
b
Millimeters
Min
—
0.250
—
0.310
Nom
—
—
0.780
0.410
Max
1.200
—
—
0.510
Inches
Min
Nom Max
—
0.0098
—
0.012
—
—
0.0307
0.016
0.0472
—
—
0.020
Datasheet
14
Jan 2011
208032-03
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