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ST7FLITE02Y1B6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'ST7FLITE02Y1B6' PDF : 124 Pages View PDF
ST7LITE0xY0, ST7LITESxY0
14 PACKAGE CHARACTERISTICS
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a Lead-free second level in-
terconnect. The category of second Level Inter-
connect is marked on the package and on the in-
ner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
14.1 PACKAGE MECHANICAL DATA
Figure 86. 20-Lead Very thin Fine pitch Quad Flat No-Lead Package
mm
inches1)
Dim.
Min Typ Max Min Typ Max
A 0.80 0.85 0.90 0.0315 0.0335 0.0354
A1 0.00 0.02 0.05
0.0008 0.0020
A3
0.02
0.0008
b 0.25 0.30 0.35 0.0098 0.0118 0.0138
D
5.00
0.1969
D2 3.10 3.25 3.35 0.1220 0.1280 0.1319
E
6.00
0.2362
E2 4.10 4.25 4.35 0.1614 0.1673 0.1713
e
0.80
0.0315
L 0.45 0.50 0.55 0.0177 0.0197 0.0217
ddd
0.08
0.0031
Number of Pins
N
20
Note 1. Values in inches are converted from mm
and rounded to 4 decimal digits.
109/124
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