STN1110 View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'STN1110' PDF : 22 Pages View PDF
STN1110
8.0 Packaging Diagrams and Parameters
8.1 SPDIP (SP) Package
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
N
NOTE 1
12 3
D
A
A1
b1
b
E1
A2
L
e
E
c
eB
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
Units
Dimension Limits
N
e
A
A2
A1
E
E1
D
L
c
b1
b
eB
MIN
—
.120
.015
.290
.240
1.345
.110
.008
.040
.014
—
INCHES
NOM
28
.100 BSC
—
.135
—
.310
.285
1.365
.130
.010
.050
.018
—
MAX
.200
.150
—
.335
.295
1.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-070B
16 of 22
www.obdsol.com
STN1110DSA
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