STN1110 View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'STN1110' PDF : 22 Pages View PDF
STN1110
8.3 SOIC 300mil (SO) Land Pattern
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MIN
Contact Pitch
E
Contact Pad Spacing
C
Contact Pad Width (x28)
X
Contact Pad Length (x28)
Y
Distance Between Pads
Gx
0.67
Distance Between Pads
G
7.40
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
MILLIMETERS
NOM
1.27 BSC
9.40
MAX
0.60
2.00
Microchip Technology Drawing C04-2052A
18 of 22
www.obdsol.com
STN1110DSA
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